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1

Method for rapid testing of thermo-mechanical characteristics of solder joints

M Nowottnick, W Scheel, K Wittke, U Pape

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 850 KB

english, 2000

2

[IEEE 2015 38th International Spring Seminar on Electronics Technology (ISSE) - Eger, Hungary (2015.5.6-2015.5.10)] 2015 38th International Spring Seminar on Electronics Technology (ISSE) - Placement of embedded temperature sensors in a printed circuit board for a manufacturing process

Neiser, Arne, Seehase, Dirk, Fink, Andreas, Nowottnick, Mathias

Year:

2015

Language:

english

File:

PDF, 451 KB

english, 2015

3

High-accuracy measurement of pulse amplitudes for new applications of ultrasonic sensors

A. Püttmer, J. Nowottnick, P. Hauptmann

Journal:

Sensors and Actuators A: Physical

Year:

1998

Language:

english

File:

PDF, 577 KB

english, 1998

4

Characterization of Ti diffusion in PVD deposited WTi/AlCu metallization on monocrystalline Si by means of secondary ion mass spectroscopy

M. Plappert, O. Humbel, A. Koprowski, M. Nowottnick

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 692 KB

english, 2012

5

Empowering LGBTQ Youth in Europe: The Work of IGLYO

Vella, Darren R., Nowottnick, Lucy, Selun, Bruno, van Roozendaal, Björn

Journal:

Journal of LGBT Youth

Year:

2009

Language:

english

File:

PDF, 72 KB

english, 2009

6

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Characterisation of silver particles used for the Low Temperature Joining Technology

Fruh, Christiane, Gunther, Michael, Rittner, Martin, Fix, Andreas, Nowottnick, Mathias

Year:

2010

Language:

english

File:

PDF, 489 KB

english, 2010

7

Reliability investigation of large area solder joints in power electronics modules and its simulative representation

George, A., Zipprich, J., Breitenbach, M., Klingler, M., Nowottnick, M.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.52 MB

english, 2018

8

Phosphor-Chalkogen-Moleküle als Komplexliganden – Reaktionen mit NbCl5

Heike Nowottnick, Klaus Stumpf, Roger Blachnik, Hans Reuter

Journal:

Zeitschrift für anorganische und allgemeine Chemie

Year:

1999

File:

PDF, 118 KB

1999

9

Aminoderivate von α-P4S3, α-P4Se3 und P3Se4 – Daten und Analyse der 31P-NMR-Spektren in Lösungen

Jörg Lutz, Heike Nowottnick, Roger Blachnik

Journal:

Zeitschrift für anorganische und allgemeine Chemie

Year:

1999

Language:

german

File:

PDF, 120 KB

german, 1999

10

Zwei neue Phosphorsulfide

Heike Nowottnick, Roger Blachnik

Journal:

Zeitschrift für anorganische und allgemeine Chemie

Year:

1999

File:

PDF, 82 KB

1999

11

Ein neues Phosphorsulfid mit Adamantangerüst: δ-P4S7

Heike Nowottnick, Roger Blachnik

Journal:

Zeitschrift für anorganische und allgemeine Chemie

Year:

2000

Language:

german

File:

PDF, 64 KB

german, 2000

12

ChemInform Abstract: Phosphorus Chalcogen Molecules as Complex Ligands — Reactions with NbCl5.

Heike Nowottnick, Klaus Stumpf, Roger Blachnik, Hans Reuter

Journal:

Year:

1999

File:

PDF, 34 KB

1999

13

ChemInform Abstract: Two New Phosphorus Sulfides.

Heike Nowottnick, Roger Blachnik

Journal:

Year:

2000

File:

PDF, 31 KB

2000

14

ChemInform Abstract: A New Phosphorus Sulfide with Adamantane Structure: δ-P4S7.

Heike Nowottnick, Roger Blachnik

Journal:

Year:

2000

File:

PDF, 32 KB

2000

15

Plasma treatment for fluxless soldering

R. Deltschew, D. Hirsch, H. Neumann, T. Herzog, K.J. Wolter, M. Nowottnick, K. Wittke

Journal:

Surface and Coatings Technology

Year:

2001

Language:

english

File:

PDF, 262 KB

english, 2001

16

Characterization of nanoscaled solder material

Andrej Novikov, Mathias Nowottnick

Journal:

physica status solidi (a)

Year:

2012

Language:

english

File:

PDF, 724 KB

english, 2012

17

Guest Editorial

Dean, R. N., Lall, P., Nowottnick, M., Harrell, W. R.

Journal:

IEEE Transactions on Industrial Electronics

Year:

2011

Language:

english

File:

PDF, 97 KB

english, 2011

18

Online simulations of mineral dust aerosol distributions: Comparisons to NAMMA observations and sensitivity to dust emission parameterization

Nowottnick, E., Colarco, P., Ferrare, R., Chen, G., Ismail, S., Anderson, B., Browell, E.

Journal:

Journal of Geophysical Research

Year:

2010

Language:

english

File:

PDF, 2.05 MB

english, 2010

19

[IEEE 2012 35th International Spring Seminar on Electronics Technology (ISSE) - Bad Aussee, Austria (2012.05.9-2012.05.13)] 2012 35th International Spring Seminar on Electronics Technology - Heat protection coatings for high temperature electronics

Bremerkamp, Felix, Seehase, Dirk, Nowottnick, Mathias

Year:

2012

Language:

english

File:

PDF, 476 KB

english, 2012

20

[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Drop impact simulations for lifetime assessment of PCB/BGA assemblies regarding pad cratering

Tsebo Simo, Grace L., Shirangi, Hossein, Nowottnick, Matthias, Dudek, Rainer, Kaulfersch, Eberhard, Rzepka, Sven, Michel, Bernd

Year:

2014

Language:

english

File:

PDF, 3.29 MB

english, 2014

21

[IEEE Comput. Soc. Press IEEE International Conference on Computer Design: VLSI in Computers and Processors - Cambridge, MA, USA (14-16 Oct. 1991)] [1991 Proceedings] IEEE International Conference on Computer Design: VLSI in Computers and Processors - Fault tolerant VLSI design with functional block redundancy

Ernst, R., Nowottnick, P.

Year:

1991

Language:

english

File:

PDF, 447 KB

english, 1991

22

[IEEE 2012 35th International Spring Seminar on Electronics Technology (ISSE) - Bad Aussee, Austria (2012.05.9-2012.05.13)] 2012 35th International Spring Seminar on Electronics Technology - Energetic analysis of solder paste deposits as reference for soldering with selective heat

Seehase, Dirk, Huth, Heiko, Bremerkamp, Felix, Nowottnick, Mathias

Year:

2012

Language:

english

File:

PDF, 524 KB

english, 2012

23

[IEEE 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO) - Birmingham, United Kingdom (2012.08.20-2012.08.23)] 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO) - Low-temperature assembling process with nanoscaled solder layers

Novikov, Andrej, Holzhuter, Gerd, Nowottnick, Mathias

Year:

2012

Language:

english

File:

PDF, 1.42 MB

english, 2012

24

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Selective cooling of sensitive PCB components by means of silica gel based cover coatings

Bremerkamp, Felix, Seehase, Dirk, Nowottnick, Mathias

Year:

2012

Language:

english

File:

PDF, 1.62 MB

english, 2012

25

[IEEE 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE) - Dresden, Germany (2014.5.7-2014.5.11)] Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Reactive paste for reflow soldering of large components

Seehase, Dirk, Huth, Heiko, Neiser, Arne, Nowottnick, Mathias

Year:

2014

Language:

english

File:

PDF, 489 KB

english, 2014

26

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Protection of printed circuit board structures in microwave process

Trinh Dung Bui,, Bremerkamp, F., Nowottnick, M., Seehase, D.

Year:

2013

Language:

english

File:

PDF, 12.38 MB

english, 2013

27

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Nanoscaled solder for low-temperature assembling processes

Novikov, Andrej, Nowottnick, Mathias

Year:

2010

Language:

english

File:

PDF, 1.65 MB

english, 2010

28

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Synthesis and characterization of nanoscaled solder material

Novikov, Andrej, Nowottnick, Mathias

Year:

2012

Language:

english

File:

PDF, 3.28 MB

english, 2012

29

[IEEE 2007 IEEE International Symposium on Industrial Electronics - Vigo, Spain (2007.06.4-2007.06.7)] 2007 IEEE International Symposium on Industrial Electronics - Soldering Technology for 3D PCB Assemblies with Microwave Heating

Nowottnick, Mathias, Diehm, Rolf

Year:

2007

Language:

english

File:

PDF, 572 KB

english, 2007

30

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Influence of the pad design on the reliability of PCB/BGA assemblies under drop excitation

Simo, Grace L. Tsebo, Shirangi, Hossein, Nowottnick, Matthias, Konstantin, Georg

Year:

2014

Language:

english

File:

PDF, 1.40 MB

english, 2014

31

Use of the CALIOP vertical feature mask for evaluating global aerosol models

Nowottnick, E. P., Colarco, P. R., Welton, E. J., da Silva, A.

Journal:

Atmospheric Measurement Techniques Discussions

Year:

2015

Language:

english

File:

PDF, 7.00 MB

english, 2015

32

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Effects of board design parameters on failure mechanisms of PCB/BGA assemblies under drop impact

Tsebo Simo, Grace L., Shirangi, Hossein, Nowottnick, Mathias, Rzepka, Sven

Year:

2015

Language:

english

File:

PDF, 1.34 MB

english, 2015

33

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Cooling of electronic assemblies through PCM containing coatings

Novikov, A., Lexow, D., Nowottnick, M.

Year:

2014

Language:

english

File:

PDF, 1.17 MB

english, 2014

34

[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Low Temperature Processing of Highly Integrated Assemblies by Selective Microwave Heating

Diehm, R., Pape, U., Nowottnick, M., Kempe, W.

Year:

2006

Language:

english

File:

PDF, 3.82 MB

english, 2006

35

[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Solder Pastes for Microwave Application

Nowottnick, Mathias, Scheel, Wolfgang, Pape, Uwe, Diehm, Rolf, Wiese, Joachim, Kempe, Wolfgang, Mallah, Marcel, Suppa, Manfred, Fink, Peter

Year:

2006

Language:

english

File:

PDF, 5.74 MB

english, 2006

36

An overview of the CATS level 1 processing algorithms and data products

Yorks, J. E., McGill, M. J., Palm, S. P., Hlavka, D. L., Selmer, P. A., Nowottnick, E. P., Vaughan, M. A., Rodier, S. D., Hart, W. D.

Journal:

Geophysical Research Letters

Year:

2016

Language:

english

File:

PDF, 1.06 MB

english, 2016

37

[IEEE 2016 39th International Spring Seminar on Electronics Technology (ISSE) - Pilsen, Czech Republic (2016.5.18-2016.5.22)] 2016 39th International Spring Seminar on Electronics Technology (ISSE) - Dynamic stress reduction and service life extension of electronic assemblies

Hartung, Marco, Viehmann, Matthias, Nowottnick, Mathias

Year:

2016

Language:

english

File:

PDF, 421 KB

english, 2016

38

Impact of radiatively interactive dust aerosols in the NASA GEOS-5 climate model: Sensitivity to dust particle shape and refractive index

Colarco, Peter R., Nowottnick, Edward P., Randles, Cynthia A., Yi, Bingqi, Yang, Ping, Kim, Kyu-Myong, Smith, Jamison A., Bardeen, Charles G.

Journal:

Journal of Geophysical Research Atmospheres

Year:

2014

Language:

english

File:

PDF, 4.61 MB

english, 2014

39

Highly variable Sn-Cu diffusion soldering process for high performance power electronics

Feil, D., Herberholz, T., Guyenot, M., Nowottnick, M.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.77 MB

english, 2017

40

Innovations

Nowottnick, Klaus

Journal:

Year:

1996

Language:

english

File:

PDF, 226 KB

english, 1996

41

Behaviors of Printed Circuit Boards Due to Microwave Supported Curing Process of Coating Materials

Bremerkamp, Felix, Nowottnick, Mathias, Seehase, Dirk, Bui, Trinh Dung

Journal:

Journal of Microwave Power and Electromagnetic Energy

Year:

2012

Language:

english

File:

PDF, 2.48 MB

english, 2012

42

[IEEE 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Sofia, Bulgaria (2017.5.10-2017.5.14)] 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Material study for full-faced heating layers, integrated in printed circuit boards

Seehase, Dirk, Lange, Fred, Novikov, Andrej, Nowottnick, Mathias

Year:

2017

Language:

english

File:

PDF, 866 KB

english, 2017

43

Letters

Osborne, Juliet L, Saville, Naomi M, Tamas, George, Nowottnick, Klaus

Journal:

Year:

1992

Language:

english

File:

PDF, 260 KB

english, 1992

44

The fate of saharan dust across the atlantic and implications for a central american dust barrier

Nowottnick, E., Colarco, P., da Silva, A., Hlavka, D., McGill, M.

Journal:

Atmospheric Chemistry and Physics

Year:

2011

Language:

english

File:

PDF, 12.22 MB

english, 2011

45

[IEEE 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Sofia, Bulgaria (2017.5.10-2017.5.14)] 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Study on the interdependence of soldering profile, ageing conditions and intermetallic layer thickness in large area solder joints and its influence on reliability

George, Allen Jose, Zipprich, Juergen, Klingler, Markus, Breitenbach, Marlies, Nowottnick, Mathias

Year:

2017

Language:

english

File:

PDF, 1.17 MB

english, 2017

46

Quantification of Osseointegration of Plasma-Polymer Coated Titanium Alloyed Implants by means of Microcomputed Tomography versus Histomorphometry

Gabler, Carolin, Zietz, Carmen, Bieck, Richard, Göhler, Rebecca, Lindner, Tobias, Haenle, Maximilian, Finke, Birgit, Meichsner, Jürgen, Testrich, Holger, Nowottnick, Mathias, Frerich, Bernhard, Bader,

Journal:

BioMed Research International

Year:

2015

Language:

english

File:

PDF, 4.06 MB

english, 2015

47

Dust Impacts on the 2012 Hurricane Nadine Track during the NASA HS3 Field Campaign

Nowottnick, E. P., Colarco, P. R., Braun, S. A., Barahona, D. O., da Silva, A., Hlavka, D. L., McGill, M. J., Spackman, J. R.

Journal:

Journal of the Atmospheric Sciences

Year:

2018

Language:

english

File:

PDF, 3.33 MB

english, 2018

48

[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Phase Change Materials for Thermal Peak Management Applications with Specific Temperature Ranges

Maxa, Jacob, Novikov, Andrej, Nowottnick, Mathias, Heimann, Matthias, Jarchoff, Kay

Year:

2018

Language:

english

File:

PDF, 753 KB

english, 2018

49

[IEEE 2018 41st International Spring Seminar on Electronics Technology (ISSE) - Zlatibor, Serbia (2018.5.16-2018.5.20)] 2018 41st International Spring Seminar on Electronics Technology (ISSE) - Endogenous Heating of Printed Circuit Boards by Means of Electromagnetic Induction on Suitable Susceptors

Seehase, Dirk, Kohlen, Christian, Neiser, Arne, Novikov, Andrej, Nowottnick, Mathias

Year:

2018

Language:

english

File:

PDF, 844 KB

english, 2018

50

[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Resistance development on embedded heating layers during climatic test

Seehase, Dirk, Novikov, Andrej, Nowottnick, Mathias

Year:

2017

Language:

english

File:

PDF, 1.56 MB

english, 2017